Although only one smartphone with Dimensity 9000 processor has been launched in India so far, MediaTek is ready to implement an even more powerful version of this processor and that is the Dimensity 9000+. The new chip resembles its less powerful brother, but delivers improvements in key areas.
What’s new in Dimensity 9000+?
Now the main improvement is in the clock speed of the primary core, which has been ramped up to deliver performance gains. MediaTek claims the new chip offers a 5% improvement in CPU performance and 10% improvement in GPU performance compared to the Dimensity 9000. The clock speed of the Cortex-X2 high-performance core has been increased from 3.05GHz to 3 .2GHz.
However, it still equips the same 1+3+4 setup with three Cortex-A710 cores and four highly efficient Cortex-A510 cores. The boosted GPU is the Mali-G710 MC10. The network modem has also been updated to support downlink speeds of up to 7 Gbps. Other than that, the rest of the chip’s specs remain essentially identical.
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Remains largely identical to Dimensity 9000
The MediaTek Dimensity 9000+ is also made using TSMC N4 (4nm class) manufacturing. It supports LPDDR5x memory with bandwidths up to 7,500 Mbps. In addition, there is MediaTek’s fifth-generation APU with a total of six cores that handle AI processing. It is claimed to offer four times the performance and energy efficiency compared to its previous generation.
It features a flagship 18-bit HDR-ISP design, allowing users to capture HDR video on three cameras simultaneously. Capture an event with all different cameras (for example: wide angle, standard and zoom) for later editing. There’s an ISP of 9 Gpixel/s along with simultaneous triple camera 18-bit HDR video recording (three cameras recording at three exposures per frame) and the world’s first 320 MP camera support for smartphones.
The chip supports up to 180 Hz FullHD+ screens. The Dimensity 9000+ also uses MediaTek 5G UltraSave 2.0, a next-generation power-saving enhancement suite. As for wireless connectivity, there is support up to Bluetooth 5.3, Wi-Fi 6E 2×2 (BW160) with up to 2x better performance efficiency than the previous generation and support for the latest 6GHz connectivity. The chip also integrates Bluetooth LE Audio-ready technology with Dual-Link True Wireless Stereo Audio and New Beidou III-B1C GNSS support.
MediaTek says devices with the Dimensity 9000+ chipset will hit shelves sometime in Q3 2022. The company has yet to share the names of the OEMs that will be using the chips on their upcoming flagships.